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Fort McDowell, United States
The 20th Annual Device Packaging Conference (DPC), Arizona
From March 18 to 21, 2024, the Annual Device Packaging Conference (DPC) will take place in Fountain Hills, Arizona. The event is organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
On March 20, starting at 2 pm, Prof. Dr. Tsvetina Dobrovolska, D.Sc. will give a presentation in the session "WP2: Fan-Out, Wafer...